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Ultrasonic Metal Bonding Machine for Power Device

Ultrasonic Metal Bonding Machine for Power Device

Ultrasonic bonding system which is appropriate for producing power device

  • High rigid clamp horn system
  • High precision alignment control
  • Sophisticated alignment control
  • Sufficient process monitoring function

IGBT Module (Terminal bonding)

IGBT Module (Terminal bonding)

It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly

Bonding Coated Wire

Bonding Coated Wire

After pressing down the coated wire, ultrasonic breaks the insulating layer and bonds the inner wire to an electrode directly

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