ULTRASONIC APPLICATION BY INDUSTRYI INNOVATE ON MANUFACTURING

ULTRASONIC APPLICATIONSemi Conductor & Electronic Component

Semi Conductor & Electronic Component

adwelds provides ultrasonic advanced machines that cope with changes in materials or manufacturing processes to improve quality of semi condutor/electronic components. Utilizing adwelds' advanced ultrasonic bonding and ultrasonic cutting in the manufacturing processes will lead to increase clients' production value. adwelds' advanced ultrasonic machines install functions to set prcessing conditions digitally and/or to monitor each process appropriately.

ABB Process

ABB Process

Cu ribbon bonding is available by using Al as a buffer material, it gives strength to a feeble base material

Bonding Coated Wire

Bonding Coated Wire

After pressing down the coated wire, ultrasonic breaks the insulating layer and bonds the inner wire to an electrode directly

Infrared Image Sensor (Cool Bond)

Infrared Image Sensor (Cool Bond)

Our ultrasonic bonding machine bonds 300,000 sharp-end bumps (Kyushu U) at once at room temperature, a collaboration with Kyushu University

IC Card (Front and back pattern pierce bonding)

IC Card (Front and back pattern pierce bonding)

When pressing down the wirings on the resin film and apply ultrasonic, ultrasonic pierces the film, without pretreatment of via processing, it bonds the wires

Urethane Sheet (High precision shape cutting)

Urethane Sheet (High precision shape cutting)

Ultrasonic helps to control deformation when bonding a soft material and realizes a high precision sectional cutting

Cutting Hard Materials

Cutting Hard Materials

Ultrasonic helps hard materials from chipping and allows high quality cutting

Cutting Silicon Thinly

Cutting Silicon Thinly

Ultrasonic controls an elastic application to deform when cutting, so it can even slice an application with a thickness of 0.2mm

Resin Film (High Quality Full Cutting)

Resin Film (High Quality Full Cutting)

Ultrasonic can cut 50μm film with a beautiful cross section

Resin Film (High Quality Half Cutting)

Resin Film (High Quality Half Cutting)

With a conventional cutting technology, a film deformed when cutting and was difficult to achieve a half-cut, but with ultrasonic assistance, it controls the film to deform and obtains stable half cutting

Dieless Shape Cutting with Mold

Dieless Shape Cutting with Mold

Bring the initial cost down to 1/10 with our cutting tools

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ULTRASONIC APPLICATION BY PROCESS

ULTRASONIC APPLICATION BY PROCESS

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