Appropriate for forming next generation power device circuit
Homogeneous/Heterogeneous Metal Bonding
It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature
IGBT Module (Ribbon Bonding)
Multiple kinds of ribbon bondings are available with multi-feeder
ABB Process
Cu ribbon bonding is available by using Al as a buffer material, it gives strength to a feeble base material
