PRODUCTSI INNOVATE ON MANUFACTURING

IGBT Ultrasonic Metal Bonding Machine(Ultrasonic metal bonder)

IGBT Ultrasonic Metal Bonding Machine(Ultrasonic metal bonder)

Ultrasonic bonding system which is appropriate for producing power device

  • Flexible manufacturing
  • Resistant to terminal floating
  • Color image processing

IGBT Module (Terminal bonding)

IGBT Module (Terminal bonding)

It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly

TO PAGE TOP