Ultrasonic bonding system which is appropriate for producing power device
Homogeneous/Heterogeneous Metal Bonding
It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature
IGBT Module (Terminal bonding)
It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly
Bonding Coated Wire
After pressing down the coated wire, ultrasonic breaks the insulating layer and bonds the inner wire to an electrode directly
