PRODUCTSI INNOVATE ON MANUFACTURING

US High Precision Flip Chip Bonder

US High Precision Flip Chip Bonder

A bonder with a high precision ultrasonic process

  • High precision alignment control
  • High quality bonding
  • Setting a detailed bonding condition

Infrared Image Sensor (Cool Bond)

Infrared Image Sensor (Cool Bond)

Our ultrasonic bonding machine bonds 300,000 sharp-end bumps (Kyushu U) at once at room temperature, a collaboration with Kyushu University

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